PDI1284P11
Parametrics
Type number |
---|
Package
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PDI1284P11DGG | PDI1284P11DGG,112 (935223080112) |
Obsolete | PDI1284P11DGG PDI1284P11DGG Standard Procedure Standard Procedure |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
Not available |
PDI1284P11DGG,118 (935223080118) |
Obsolete | PDI1284P11DGG PDI1284P11DGG Standard Procedure Standard Procedure | SOT362-1_118 | ||||
PDI1284P11DGG,698 (935223080698) |
Obsolete | PDI1284P11DGG PDI1284P11DGG Standard Procedure Standard Procedure | Not available | ||||
PDI1284P11DL | PDI1284P11DL,112 (935223090112) |
Obsolete | PDI1284P11DL |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
PDI1284P11DL,118 (935223090118) |
Obsolete | PDI1284P11DL | SOT370-1_118 |
Environmental information
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
PDI1284P11DGG | PDI1284P11DGG,112 | PDI1284P11DGG | ||
PDI1284P11DGG | PDI1284P11DGG,118 | PDI1284P11DGG | ||
PDI1284P11DGG | PDI1284P11DGG,698 | PDI1284P11DGG | ||
PDI1284P11DL | PDI1284P11DL,112 | PDI1284P11DL | ||
PDI1284P11DL | PDI1284P11DL,118 | PDI1284P11DL |
Documentation (9)
File name | Title | Type | Date |
---|---|---|---|
PDI1284P11 | 3.3 V parallel interface transceiver/buffer | Data sheet | 2021-07-06 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
Ordering, pricing & availability
Sample
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