Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Parametrics

Type number Package version Package name Size (mm) Configuration Nr of lines VRWM (V) (V) Cd [typ] (pF) IPPM [max] (A) VESD (kV) (kV)
PCMF1HDMI2S WLCSP5_2-1-2 WLCSP5 0.77 x 1.17 x 0.57 Unidirectional 1 5 0.25 7 15
PCMF2HDMI2S WLCSP10_4-2-4 WLCSP10 1.57 x 1.17 x 0.57 Unidirectional 2 5 0.25 7 15
PCMF3HDMI2S WLCSP15_6-3-6 WLCSP15 2.37 x 1.17 x 0.57 Unidirectional 3 5 0.25 7 15

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PCMF1HDMI2S PCMF1HDMI2SZ
(934070092087)
Active P "with circle" WLCSP5_2-1-2
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2 Not available
PCMF2HDMI2S PCMF2HDMI2SZ
(934070093087)
Active P with circle WLCSP10_4-2-4
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4 WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087
PCMF3HDMI2S PCMF3HDMI2SZ
(934070094087)
Active P with circle WLCSP15_6-3-6
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6 WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
PCMF1HDMI2S PCMF1HDMI2SZ PCMF1HDMI2S rohs rhf rhf
PCMF2HDMI2S PCMF2HDMI2SZ PCMF2HDMI2S rohs rhf rhf
PCMF3HDMI2S PCMF3HDMI2SZ PCMF3HDMI2S rohs rhf rhf
Quality and reliability disclaimer

Documentation (10)

File name Title Type Date
PCMFXHDMI2S_SER Common-mode EMI filter for differential channels with integrated ESD protection Data sheet 2017-05-04
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
WLCSP5_2-1-2 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP10_4-2-4 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13

Ordering, pricing & availability

Sample

As a Nexperia customer you can order samples via our sales organization.

If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.